| Design |
|---|
| JEDEC standard | Yes |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Internal memory | 32 GB |
| Internal memory type | DDR4 |
| Memory clock speed | 2666 MHz |
| Component for | PC/server |
| ECC | Yes |
| Memory layout (modules x size) | 1 x 32 GB |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 19 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 4096M x 72 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Internal memory | 32 GB |
| Internal memory type | DDR4 |
| Memory clock speed | 2666 MHz |
| Component for | PC/server |
| ECC | Yes |
| Memory layout (modules x size) | 1 x 32 GB |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 19 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 4096M x 72 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Technical details |
|---|
| Compliance certificates | RoHS |
| Weight & dimensions |
|---|
| Width | 2.74" (69.6 mm) |
| Depth | 0.146" (3.7 mm) |
| Height | 1.18" (30 mm) |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |