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Increasing air to flow from bottom to top is part of airflow management. The Vertiv™ VR Roof Fan needs to be paired with the Networking Roof Panel for a zero U application. The Vertiv™ VRA2008 is a 120 VAC Top Fan Kit. Maintaining the efficiency of your network’s cooling system not only decreases the wear-and-tear on your IT equipment, it assists with sustainability and helps make less of a carbon footprint.

Expand your display’s connectivityGet Wi-Fi and Bluetooth connectivity to connect your display to the web or Bluetooth devices like speakers and microphones.Turn your display into a Wi-Fi hotspotPlug the adapter into a BenQ display and set up a Wi-Fi hotspot to share your Ethernet connection with multiple devices. This is perfect for meeting rooms that need wireless screen sharing.Upgrade your display with Bluetooth devicesConnecting the WD02AT to your interactive display allows you to use Bluetooth devices such as keyboards, mice, and speakers without the hassle of cables.A faster Wi-Fi connectionThe WD02AT connects to either the 2.4 GHz or 5 GHz band, guaranteeing steady speeds of up to 1201 Mbps. *Maximum internet speed may vary depending on network environment.One-click wireless screen sharingWirelessly cast your screen with a single click. The WD02AT is fully compatible with the InstaShare Button, allowing connected devices to share their screens, camera feeds, or files on the BenQ Board.

ThinkSystem TruDDR4 Memory delivers trusted, tested, quality, performance, and reliability throughout the ThinkSystem portfolio. We use the highest quality industry-standard memory components sourced from Tier 1 DRAM suppliers. Only memory that meets these strict requirements are selected for TruDDR4 Memory. It is then compatibility tested and tuned on every ThinkSystem server to maximize reliability.In addition, TruDDR4 Memory DIMMs have a unique signature programmed into them so your system can verify that TruDDR4 Memory is installed in your system. Since the memory will be authenticated, memory stretch goals are enabled only when TruDDR4 Memory DIMMs are detected. Together with lower power consumption, these new DIMMs can provide the lowest TCO for data centers.3DS RDIMMsTo meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.